Optimization of a Joint Economic Lot Size Model for a First-tier Supplier with Sequential Processes Using a Genetic Algorithm

Authors

  • DongJin Jin Department of industrial engineering, Yonsei University, Seoul, Republic of KOREA
  • MoonHyeung Lee Department of industrial engineering, Yonsei University, Seoul, Republic of KOREA
  • Byung Do Chung Department of industrial engineering, Yonsei University, Seoul, Republic of KOREA

DOI:

https://doi.org/10.14738/tmlai.65.5351

Keywords:

Integrated supply chain, First-tier supplier, Lot size, Nonlinear programming, Genetic algorithm

Abstract

As corporate competition intensifies in the 21st century, optimal in the integrated supply chain is more important than optimization of individual company. Our research examines a series of integrated supply chain systems comprising a single raw material supplier, a first-tier supplier with multiple processes, and a single original equipment manufacturer in the Korean automotive industry. Unlike other papers, we have studied the situation in which the first-tier supplier has an assembly process. We have also analyzed the situation in which the demand for semi-finished products occurs in the first-tier supplier process or in which semi-finished products are purchased from subcontractors and put into production. The objective function is to minimize the sum of production costs, inventory holding costs, ordering costs, and setup costs in the integrated supply chain. To solve this problem, we formulated nonlinear programming, and developed a genetic algorithm. The results showed that using a dynamic lot size is cheaper than using a fixed lot size. In addition, the lower the setup cost, the smaller the lot size, and when a certain level is reached, the lot size will be the same even if the cost changes.

References

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Published

2018-11-03

How to Cite

Jin, D., Lee, M., & Chung, B. D. (2018). Optimization of a Joint Economic Lot Size Model for a First-tier Supplier with Sequential Processes Using a Genetic Algorithm. Transactions on Engineering and Computing Sciences, 6(5), 28. https://doi.org/10.14738/tmlai.65.5351